How Lumenci's reverse engineering exposed infringement sealed inside multiple accused OLED displays
Claims written against circuitry cannot be proven from the outside. Lumenci did it by opening more than 10 accused devices, turning the products themselves into the evidence behind 20 asserted patents
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Case at a Glance
Domain
Service
Client
Outcome
Twenty patents, each one proven against the actual silicon, not a datasheet.
Listing the components is easy. Proving how they're wired is the actual work.
What most teams do.
What Lumenci did instead.
Extracted circuit-level architecture from all multiple accused devices, at roughly two weeks per product.
Why it mattered.
How It Was Done
Lumenci ran the analysis from intact device through to claim charts, staffed with semiconductor engineers who could delayer a display stack and patent analysts who know what a claim chart has to prove.
Complete teardown of the accused OLED displays, with samples prepared to reach the functional layers without destroying the structures under investigation.
Layer-by-layer processing exposed the internal architecture of the display stack, with imaging at each stage to characterize both structure and materials.
Pixel, driver, and under-display camera architectures were extracted and signal paths traced. The UDC region introduced structural and optical complexity that had to be resolved separately from the main display area.
Spectroscopy and SEM/EDS established material composition and optical properties, for the claims that read on more than geometry.
Findings were built into full claim charts across the asserted patents, with multiple infringement theories per patent wherever the physical evidence supported more than one reading.
What Changed for the Client
Where they stood.
Infringement theories across 20 patents, each backed by structures the team had physically opened, imaged, and characterized
What Lumenci Established.
The other side had to contest the physical evidence itself, rather than argue about what the public documentation does or does not disclose
Where it stands.
The matter is ongoing, with the technical record built and the claim charts in hand
Client testimonial
"No one we have worked with previously has been able to perform such an in-depth circuit analysis"
- Partner, AmLaw 100 firm
. Semiconductor Reverse Engineering for Patent litigation
We open devices to establish what they actually contain, in our own labs. Our practice is part of an integrated IP services platform spanning claim charting, source code review, expert testimony, and litigation support.
100k+ Patents Analyzed
1200+ Products Tested
250+ Litigations Supported
What This Would Look Like for Your Matter
A scoping conversation covers the accused products, the asserted claims, which structures those claims actually read on, and your contentions deadline. You get a view of what the devices can be made to show before committing to a full teardown programme.
Frequently Asked Questions
When does a patent case need destructive reverse engineering?
When the asserted claims read on internal structure that no datasheet, product page, or public teardown discloses. In highly integrated displays and semiconductors that is usually the case. If the claim language describes something invisible from outside the device, the device has to be opened.
What does circuit extraction add that a teardown report does not?
A teardown identifies components and system architecture. Circuit extraction reconstructs how those components are wired and what the circuit does, which is the level patent claims are typically written against.
Can several accused devices be analyzed without extrapolating from one?
They can, given a repeatable process rather than a bespoke investigation per product. The alternative is sampling, which leaves the analysis open to an argument about whether the chosen device represents the rest of the accused set.
How is under-display camera architecture analyzed?
The UDC region introduces structural and optical complexity that does not exist elsewhere in the panel, so it is characterized separately, combining circuit extraction with optical and materials analysis.
How long does a multi-device reverse engineering programme take?
It depends on device complexity and how many claims need physical support. On this matter the turnaround settled at roughly two weeks per product once the process was established.